国家/地区 中国（5）
IPC部 C（5） B（2）
IPC大类 C08（3） C09（3）
IPC小类 C08K（3） C08L（3） C09J（2）
IPC C08K003/18（3） C08K003/04（2） C08K003/22（2）
C08L063/00（2）
发明人 GONG Y（5）
公开年 2021（2）
申请年 2021（3） 
专利权人 AEROSPACE SPECIAL MATERIALS PROCESSING（5）

Preparation of highly reliable polyimide resin wave-absorbing adhesive film with controllable fluidity used in e.g. military stealth, involves preparing polyimide resin matrix, placing absorbent and inorganic filler in mixer to obtain blank, obtaining film, and punching by hole punch.

GONG Y, ZHU W, LI Y, LIU P, LI M, LV T

Wave-absorbing film comprises wave-absorbing adhesive film comprising reinforcing layer or adhesive film layer, wave-absorbing layer and backing, where wave-absorbing layer and backing are respectively arranged on outermost side of wave-absorbing film.

GONG Y, PANG C, LI Y, LV T, LI M

Preparation method of wave-absorbing epoxy resin of wave-absorbing epoxy resin composite material, involves banburying and coarse mixing epoxy resin and absorbent, refining, mixing, adding curing agent, triggering and curing wave-absorbing epoxy resin curing system at different temperature stages.

LV T, LI Y, GONG Y, LI M, ZHAO H

Preparing co-cured wave-absorbing composite material comprises paving one layer of first prepreg on forming mold, pre-compacting, paving one layer of second prepreg, covering one layer of absorbing adhesive film on the composite material substrate, covering one layer of third prepreg and curing.

GONG Y, YAN L, LI M, LV T, LI Y

Magnetic wave absorbing resin preparation involves mixing magnetic absorbent and graphene, ball-milling to obtain composite modified material, and then mixing composite modified material and resin curing agent.

LIU J, LU M, GONG Y, OU Q, ZHAO H, ZHANG T