国家/地区 美国（2）
IPC部 H（2）
IPC大类
IPC小类
IPC
发明人 CHANG K（3） LAI C（3） CHEN J（2）
公开年 2018（2）
申请年 2017（3）
专利权人 BGT MATERIALS LTD（3）

LED lamp bulb has LED chips which are electrically connected to conductive portion at both ends of substrate, and phosphor that is attached on light emitting side of LED chips.

LAI Z, ZHANG G, LAI C, CHANG K

Manufacturing method for polymer printed circuit board (PCB), involves forming circuit pattern of porous laser induced graphene (LIG) on polymer material layer, and depositing metal nanoparticles on LIG.

CHANG K, CHEN J, KE W, ZHANG J, LAI C

Graphene-rich baking varnish for metal surface coating, comprises graphene nanoflakes, dispersant including non-ionic/ionic dispersant, binder made of thermoplastic polymer and carrier including aqueous liquid and organic solvent.

LAI C, CHANG K, CHEN J