国家/地区 美国（2） 世界知识产权组织（2）
IPC部 H（2）
IPC大类 H01（2）
IPC小类
IPC
发明人 KIM H（2）
公开年 2013（2）
申请年 2012（2） 
专利权人 KIM H（2）

Contact of electronic package, such as semiconductor device, has barrier layer comprising graphene which separates first layer comprising conductor and a second layer comprising conductor or semiconductor.

REN F, PEARTON S J, KIM J, KIM H

Graphene-based laminate has substrate, graphene layer which is formed at upper portion of substrate, and organic dopant which is formed on surface(s) of substrate.

KIM H, KIM T, YANG W, KIM H K, KIM T Y, YANG W S