国家/地区 中国（2）
IPC部
IPC大类
IPC小类
IPC
发明人 CHEN Y（2）
公开年 2020（2）
申请年
专利权人 UNIV CHINA ELECTRONIC SCI TECHNOLOGY（2）

High-dielectric composite material comprises copper foil, polyphenylene ether resin and copper foil sequentially stacked, where polyphenylene ether resin has sandwich structure film composed of graphene oxide and barium titanate films.

CHEN Y, CAO J, BI J, YAN D, HE W, WANG S, WANG M, TAN J, ZHOU G

Through-hole plating method for printed circuit boards, involves grafting graphene oxide with gamma-aminoethylaminopropyltrimethoxysilane to give product, adsorbing product of active metal ions, and electroplating.

CHEN Y, WANG Y, LI Q, HE W, WANG C, WANG S, ZHOU G, WANG Q, AI K, HU Z