国家/地区 中国（2）
IPC部
IPC大类
IPC小类
IPC
发明人 WANG J（2）
公开年 2022（2）
申请年 2022（2） 
专利权人 UNIV HARBIN SCI TECHNOLOGY（2）

High retention rate multi-size particle reinforced low-temperature composite brazing filler metal for electronic package, comprises micron, submicron, nano-sized reinforced particles and a low temperature brazing filler metal matrix alloy.

WENG G, CHANG J, YIN J, SUN Y, WANG J

Graded circulation type chip radiator, comprises heat conducting silicone grease for conducting heat, heat conducting copper plate, nano fluid for primary heat exchange, trapezoidal silicon substrate fin for secondary heat exchange, and temperature control switch for lithium bromide diluted solution.

CUI S, JIA J, WANG J, CHEN J