国家/地区 中国（2）
IPC部 C（2）
IPC大类 C09（2）
IPC小类
IPC
发明人 LI W（2） SUN X（2） YAN C（2）
ZHAO Z（2）
公开年 2023（2）
申请年
专利权人 UNIV JIANGSU SCI TECHNOLOGY（2）

High thermal conductivity electromagnetic shielding material module used for e.g. chip, comprises heat conduction layer, and heat dissipation layer, where heat conduction layer is polymer heat conduction adhesive film, and heat dissipation layer is copper foil, aluminum foil or graphite sheet.

YAN C, LI W, SUN X, ZHAO Z

Heat-conductive water vapor barrier coating stock solution used in solar cell, organic LED protection, electronic material encapsulation and packaging, comprises base resin, sheet filler, spherical filler, solvent, silane coupling agent and curing agent.

LI W, YAN C, SUN X, ZHAO Z