国家/地区 中国（4）
IPC部 C（4）
IPC大类 C09（4）
IPC小类 C09D（3）
IPC C09D005/08（2） C09D007/12（2） C09D007/61（2）
C09D163/00（2） C09D175/04（2）
发明人 GAO Y（2） LI W（2） SUN X（2）
YAN C（2） ZHAO Z（2）
公开年 2016（2） 2023（2）
申请年 2016（2） 
专利权人 UNIV JIANGSU SCI TECHNOLOGY（4）

High thermal conductivity electromagnetic shielding material module used for e.g. chip, comprises heat conduction layer, and heat dissipation layer, where heat conduction layer is polymer heat conduction adhesive film, and heat dissipation layer is copper foil, aluminum foil or graphite sheet.

YAN C, LI W, SUN X, ZHAO Z

Heat-conductive water vapor barrier coating stock solution used in solar cell, organic LED protection, electronic material encapsulation and packaging, comprises base resin, sheet filler, spherical filler, solvent, silane coupling agent and curing agent.

LI W, YAN C, SUN X, ZHAO Z

Anticorrosive paint used for metal rust layer, comprises resin containing phenolic epoxy resin, solvent containing octanol, pigment containing zinc phosphate, filler containing graphene, additive and corrosion inhibitor containing lactate.

GAO Y, LIU B

Graphene oxide-containing aqueous epoxy anticorrosive coating comprises aqueous epoxy resin, anticorrosive pigment, hydrophobic agent, graphene oxide, filler, deionized water, anti-flash rust agent and aqueous epoxy curing agent.

CHEN L, GAO Y, ZHOU J, ZUO Y