国家/地区 中国（2）
IPC部 H（2）
IPC大类
IPC小类
IPC
发明人 WANG N（2）
公开年
申请年 2020（2）
专利权人 WANG N（2）

Preparation of graphene reinforced thermal conductive composite film for electronic product, involves punching graphene film to form graphene film with closed bubble structure, coating fluidity-adjusted polymer on graphene film and curing.

WANG N

Graphene material microphone back plate, has back plate body coated with graphene layer, where thickness of back plate body is provided with multiple sizes and thickness of back plate body is in specific range.

WANG N