国家/地区 台湾（2）
IPC部 H（2）
IPC大类 H01（2）
IPC小类
IPC
发明人 WANG W（2）
公开年 2011（2）
申请年
专利权人 WANG W（2）

Heat dissipation device of electronic/photoelectric element using binding adhesive comprising at least resin and graphene or resin and carbon nanotube between an electronic/photoelectric element and a soaking block.

WANG W

Method for enhancing current-carrying ability of polymer thermistor add graphene or carbon nanotubes in an existing PPTC thermistor compositions due to their excellent electrical conductivity and physical properties.

WANG W