国家/地区 中国（2）
IPC部
IPC大类
IPC小类
IPC
发明人 CAO L（2）
公开年
申请年
专利权人 HARBIN INST TECHNOLOGY（2）

Method for packaging sandwich type graphene heat dissipation plate involves performing surface metallization from top to bottom of silver-based solder, perforated graphene, silver-based solder and copper foil assembly.

SUN Z, CAO L, ZHANG L, FENG J

Aqueous epoxy resin coating comprises aqueous epoxy resin colloid, zinc powder, graphene microchip, color filler, and aqueous epoxy curing agent.

LIU H, ZHANG S, BI S, ZUO Y, WANG C, CAO L