国家/地区 印度（4）
IPC部 B（4） C（4） G（2）
H（2）
IPC大类 B01（3） C07（2） C08（2）
H01（2）
IPC小类 B01J（3） C07C（2） H01L（2）
IPC B01J021/04（2） B01J023/89（2） B01J037/00（2）
B01J037/02（2） B01J037/03（2） B01J037/08（2）
H01L023/532（2）
发明人 CHEN C（4）
公开年 2021（2）
申请年 2021（2） 
专利权人 AIR HOLDINGS.（2）

Method for fabricating topological semi-metal interconnect, involves forming dielectric layer between interconnects, and forming hermetic cap layer on top of one or more interconnect.

NOGAMI T, NARAYANAN V, LANZILLO N A, CHEN C, RANJILO N A

Modified copper-zinc-alumina catalyst used in composition for reducing carbon dioxide for preparing liquid product mixture, contains copper, zinc, aluminum, oxygen, elements chosen from cobalt, iron or nickel and optionally elements chosen from e.g. manganese, silver, niobium and zirconium.

SHEEHAN S W, CHEN C, CLOTH T

Catalyst useful for converting hydrogen gas and carbon dioxide into other materials comprises molybdenum, first element including group metal, second element including e.g. sulfur, carbon, and oxygen and optionally least one group IA metals.

SHEEHAN S W, CHEN C, CHEN Q

Printed electronic device such as integrated circuit and printed circuit board comprises substrate and layer of electrically conductive ink comprising functionalized graphene sheets and binder applied to the substrate.

AKSAY I A, CHEN C, CHIANG K S, KORKUT S, LETTOW J S, PRUDHOMME R K, CRAIN J M, AKSAY I, CHIANG K, LETTOW J, PRUDHOMME R, PRUD HOMME R K, KORKUT S A, PRUD H R K, AKSAY L A