国家/地区 中国（5）
IPC部 C（5）
IPC大类 C09（5）
IPC小类 C08K（2） C08L（2） C09D（2）
C09K（2）
IPC C09D005/08（2） C09D183/06（2） C09K005/14（2）
发明人 GAO X（5）
公开年 2021（4）
申请年 2021（5）
专利权人 UNIV QIQIHAR（2）

High heat radiation combined protective film for electronic device, has protective film main bodies composed of upper graphene heat conducting layer, static removing layer, anti-electromagnetic layer, protective film layer and adhesive layer.

GAO X

Preparing heat-conducting engineering plastic involves carboxylation treatment, pretreatment, sintering, ionization, drying, ball milling, hydrogel preparation, aerogel preparation and finished products.

GAO X

Preparing graphene silicon dioxide bonding graft polyaniline/aqueous epoxy-containing silicon resin compound coating used for preparing epoxy resin compound anticorrosive coating, comprises e. g, adding graphene oxide into de-ionized water and dispersing to obtain graphene oxide dispersion liquid.

LIU L, ZHANG N, LI Y, GAO X

Preparing phosphate-polyaniline-silicon dioxide graft modified graphene/aqueous-based epoxy-containing silicone resin composite coating comprises dispersing phosphate-polyaniline- silicon dioxide graft modified graphene in aqueous epoxy-containing epoxy resin, coating on metal, heating and curing.

ZHAO Y, ZHAO T, LI Y, GAO X

Heat conducting polymer composite material, prepared by preparing crystalline polymer material and heat conducting filler into material with shish-kebab crystal structure, and heat compressing resulting material along kebab direction.

GAO X, CHEN B, DENG C, HUANG W