国家/地区 台湾（4）
IPC部 C（4）
IPC大类 C01（4） C25（2）
IPC小类 C01B（4）
IPC
发明人 LEE C（4）
公开年
申请年
专利权人

Manufacturing aluminum nitride used as packaging substrate of semiconductors, involves heating electrolyte comprising choline chloride, urea, aluminum chloride, boric acid and ascorbic acid, applying operating current to electroplate aluminum on workpiece, and annealing aluminum on the workpiece.

CHUNG C, LEE C, PENG K, KUNZENG P, LEE C Y, ZHONG Q

Electrochemical method for preparing defective graphene comprises, putting anode and cathode into electrolytic solution.

LEE C, HSU S

Anti-corrosion composite layer used for protecting metal building materials, comprises anti-corrosion coatings, graphene nanosheets and carrier resins, on substrate in preset order.

WU M Y, HSIEH C, LEE C, CHEN J, HSIEH S, WU Y, XIE C, LI J, XIE S, HSIEH C Y, LEE C H, CHEN J R, HSIEH S L

Electrochemical method for producing graphene includes putting a graphite working electrode and an auxiliary electrode in an electrolyte.

LEE C, CHEN C, LEE C L, CHEN C W