国家/地区 韩国（2）
IPC部
IPC大类
IPC小类
IPC
发明人 LEE D（2）
公开年 2023（2）
申请年 2022（2）
专利权人

Semiconductor device for use in electronic apparatus, has source/drain structure including silicide film to be formed between first semiconductor region and first electrode, and conductive barrier to be formed.

KIM C, NAM S, SHIN K, LEE D, LI D, JIN C, NAM S G, SHIN K W, LEE D H

Two-component urea-bond-containing coating composition used for forming coating film for marking pavement surface, comprises main agent containing diethyl aspartate, acrylate modified amine, and polyaspartic acid ester amine, and curing agent containing aliphatic polyisocyanate.

KIMJAEHAK, KIM H G, LEE D