国家/地区 中国（3）
IPC部 H（3） F（2）
IPC大类 H05（2）
IPC小类 H05K（2）
IPC H05K007/20（2）
发明人 LIN K（3）
公开年 2021（3）
申请年
专利权人

Semiconductor device comprises gate structure above channel element comprising channel layer containing silicon, germanium or semiconductor elements, and channel layer containing two-dimensional material.

KHADERBAD M A, MA H, LIN G, SHEN Z, SATHAIYA D M, LIN K, SHEN T, KARDERBARTMURUNALAPJIT, SATAYYADANYAKUMAHAVIER, SENSORMIN, DHANYKUMAR S M

Optical device for transmitting multiple channel wavelengths, has first heatsink that is arranged on first sidewall of housing configured to communicate generated heat, and one layer of graphene that is arranged on first heatsink.

CAI Z, CHENG H, LIN K, ZHENG H

Remote heat exchanging module for e.g. portable computer, has heat generated by heat source transferred to second end of second heat conduction element sequentially through the first heat conduction element, and dissipated out of remote heat exchanging module through the heat dissipation element.

LIAO W, LIN K, LIN G