国家/地区 中国（2）
IPC部
IPC大类
IPC小类
IPC
发明人 LIN W（2）
公开年 2023（2）
申请年 2023（2）
专利权人

Preparation of sensor involves stacking obtained sensing structure layers and polydimethylsiloxane substrate from top to bottom, and attaching polyimide adhesive tape to edge of formed composite sensing structure layer for encapsulation and fixation.

ZHANG M, QIU R, SUN Q, LIN W, YAN Y

High-barrier packaging material used for packaging articles such as medicine, comprises aluminum foil, polyethylene (PE) adhesive layer, barrier layer, PE adhesive layer, substrate and PE film, where barrier layer comprises ethylene-vinyl alcohol copolymer, and acetylated chitosan nanofiber.

ZHU H, JIN W, GAO Y, TAO J, ZHANG D, LIN W