国家/地区 中国（2）
IPC部 C（2）
IPC大类
IPC小类
IPC
发明人 PENG T（2）
公开年 2023（2）
申请年 2023（2）
专利权人

Heat-conducting adhesive film useful for electronic module, comprises e.g. epoxy resin, epoxy resin curing agent, film-forming resin, ethylene glycol diglycidyl ether, silicon micropowder, glass powder, nano-dioxide, quartz powder, aluminum nitride, silicon nitride and graphene oxide.

XU J, HUANG Z, QI F, ZOU W, PENG T

Producing low-cost graphene used in polymer materials, by grinding graphite, recycled plastic material, non-metal particles and additives using ball mill, classifying, performing high-temperature steam pressure treatment, shearing, burning under lower ignition temperature, and combusting product.

PENG T