国家/地区 中国（4）
IPC部 C（3） H（2）
IPC大类 H01（2）
IPC小类
IPC
发明人 PENG T（4）
公开年 2023（4）
申请年 2022（2）  2023（2） 
专利权人

Heat-conducting adhesive film useful for electronic module, comprises e.g. epoxy resin, epoxy resin curing agent, film-forming resin, ethylene glycol diglycidyl ether, silicon micropowder, glass powder, nano-dioxide, quartz powder, aluminum nitride, silicon nitride and graphene oxide.

XU J, HUANG Z, QI F, ZOU W, PENG T

Producing low-cost graphene used in polymer materials, by grinding graphite, recycled plastic material, non-metal particles and additives using ball mill, classifying, performing high-temperature steam pressure treatment, shearing, burning under lower ignition temperature, and combusting product.

PENG T

Heat-resistant radio frequency coaxial cable, has inner conductor, insulating layer, shielding layer and outer protective sheath, where insulating layer is wrapped on outer end surface of inner conductor, insulating layer is composed of inner sheath layer, foam layer and outer sheath layer.

PENG T

Preparing hard carbon cathode material comprises passivating hard carbon precursor, where hard carbon precursor comprises modified hard carbon precursor comprising pre-lithiated hard carbon and/or pre-sodium hard carbon precursors, and passivation treatment comprises reacting sodium and/or lithium.

TAN G, CHEN H, ZHANG Z, YU Y, PENG T, HU L