国家/地区 中国（2）
IPC部 C（2）
IPC大类
IPC小类
IPC
发明人 WENG C（2）
公开年 2022（2）
申请年
专利权人

Preparing microfluidic chip through nickel composite power casting core by vacuum coating and gold-spraying conduction treating silicon female mold, placing in composite electroform liquid, electroforming, cleaning, and injection molding.

JIANG B, QIANG J, SUN H, WANG Y, WENG C

Shock-absorbing buffer moving pad used in sports equipment field comprises TPV thermoplastic elastic foaming material, comprising thermoplastic elastomer, so that the pad has shock-absorbing buffer property.

WENG C