国家/地区 中国（2）
IPC部 H（2）
IPC大类 H01（2）
IPC小类 H01L（2）
IPC
发明人 ZENG F（2）
公开年
申请年 2017（2）
专利权人

Method for suppressing copper electromigration in wafer bonding, involves performing heat treatment to semiconductor substrates so that copper layer is formed by bonding graphene on copper layer.

DING T, WANG J, WANG X, LI C, GUO S, XING R, ZENG F

Schottky solar battery, comprises back electrode, positive electrode grid, semiconductor layer, amorphous carbon film I and graphene layer catalyzed by copper film in which is contact with copper thin film.

XU K, LIU X, FU L, XU W, LI Y, WANG Y, MA H, ZENG F, DU Y, CHEN L