国家/地区 中国（4）
IPC部 C（4）
IPC大类 C09（4）
IPC小类 C09D（4）
IPC C09D007/61（4）
发明人 ZHANG Q（4）
公开年 2023（4）
申请年 2022（3） 
专利权人

Preparing chitosan modified boron nitride and graphene fiber composite material useful for thermal conductivity modification of epoxy resin, comprises e.g. dissolving chitosan in acetic acid solution, adding phytic acid solution containing choline chloride, adding boron nitride and centrifuging.

ZHANG Q, WANG S

Graphene heat-conducting glue used in preparation of circuit board, comprises white graphene, three-proof coating and stabilizer.

WAN Q, WANG Z, YANG S, ZHANG Q, LI Q, NIU D, HUANG L, WANG H, LIAO S, YU Z

High thermal conductivity aluminum-based liquid cooling plate base material used in power battery system, comprises aluminum plate and polyimide layer coated on aluminum plate and polyimide layer comprises polyimide and graphene/cuprous oxide composites uniformly dispersed in polyimide.

XU Z, LIU G, ZHU C, CAO H, ZHANG Q

Casting magnesium alloy protective coating system comprises matched sealing varnish and anticorrosive primer, where sealing varnish comprises A component and B component, anti-corrosion primer comprises propyl component and butyl component, and component A is silicon modified phenolic epoxy resin.

SUN Z, YANG K, YANG M, ZHENG Y, MA Y, LI B, ZHANG J, ZHANG Q