国家/地区 中国（2）
IPC部 B（2） C（2）
IPC大类 B05（2）
IPC小类 B05D（2）
IPC B05D005/06（2）
发明人
公开年 2022（2）
申请年 2022（2） 
专利权人

Laser contacting process used for bonding semiconductor elements, involves controlling amount of laser light absorbed by laser control structure, and bonding contacting sections and contacting object.

JANG K S, EOM Y S, CHOI G, CHOI K, JOO J, MOON S, LEE C, CHANG K S, MUN C K, JOO J H, MOON S H, LEE C M, WEN S, ZHU Z, CUI G, YAN L, CHANG K

Preparing superhydrophilic nickel-based multilayer composite membrane material useful in field of photothermal seawater desalination or photothermal sewage purification, comprises e.g. dissolving nickel salt, complexing agent and surfactant in water, and soaking composite structure in salt solution.

MA F, ZENG Z, ZHU L