国家/地区 中国（7）
IPC部 B（8）
IPC大类 C04（8）
IPC小类 C04B（8）
IPC C04B026/04（8）
发明人 ZHANG Y（2）
公开年 2023（2）
申请年 2020（2）  2022（2） 
专利权人

Antistatic sound-absorbing material used as loudspeaker and electronic device, comprises molecular sieve particles, adhesives and antistatic additives.

GONG C, ZHANG L, GUO M, MA Y, ZHANG Z

Airgel for use in anti-heat insulation material, is obtained by directional freezing and drying a mixed solution of carbon fiber, binder and graphene oxide, where carbon fibers include hollow carbon fibers.

GAO J, WEI W, LIU M, ZHANG Y, ZHENG C, LAN X, DENG P

Concrete composite used for electrical circuit, and generating electricity, and used in wall, floor, post or building, comprises concrete and thermoelectric material comprising composite sulfide mineral, where composite comprises concrete.

SANTAMARIA R D A, GONZALEZ C J A, SANTAMARIA RAZO D A, GONZALEZ CALDERON J A

Structure-enhanced heat insulating plate comprises main body, reinforced component, first polyester non-woven fabric and second polyester non-woven fabric; main body is alkalescent, reinforced component fixed in main body.

XIE Y

Graphite tube material has graphite powder including carbon fiber powder and/or silicon carbide powder dispersed with graphene oxide and synthetic resin which is blended or single phenolic resin, furan resin, epoxy resin and vinyl resin.

FENG X, ZHANG Y, FENG J

Graphene-modified building film structural material comprises polytetrafluoroethylene layer, adhesive layer, graphene layer and protective layer, where lower surface of adhesive layer is provided with polytetrafluoroethylene layer.

LI K, LI W, SONG N, LI Z

Processing stone plastic toilet (sic) includes removing impurities of stone powder, heating, crushing, mixing with thermoplastic resin, adding e.g. graphene oxide, heating, demolding, and connecting toilet seat and inner liner by casting.

MA S

Graphene heat sink comprises a heat dissipation layer and a substrate, where the substrate is provided with a first surface having two-dimensional or three-dimensional structure.

BAI D