国家/地区 美国（3）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08G（3） C08J（3） C08K（3）
C08L（2） C09D（2） H01L（2）
IPC C08G077/08（3）
发明人 FUJIMOTO T（2） MANDAL S（2）
公开年 2022（2）
申请年 2020（2） 
专利权人 MOMENTIVE PE.（2）

Preparation of oriented heat conducting sheet used in semiconductor heat dissipating device, involves placing fluid composition in orientation molding device having sleeve barrel, applying circumferential shear force, heat-curing formed multilayer aggregate, and slicing oriented composition block.

REN Z, WANG H, GU Z

Addition curable silicone-imide composition for cured silicone-imide material for e.g., aerospace device, comprises alkenyl functional siloxane-imide copolymer, alkenyl functional organosiloxane, polyorganohydrogensiloxane and catalyst.

MILLER C, NARAYANAN R, ZAMPELLA J, RAJENDRA V, FUJIMOTO T, MANDAL S

Condensation curable composition for use in cured silicone-imide material for article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises silicone-imide base polymer, crosslinker, and condensation cure catalyst.

KONWAR D B, FUJIMOTO T, MANDAL S