国家/地区 中国（2）
IPC部 B（2） C（2）
IPC大类 C08（2）
IPC小类 C08K（2） C08L（2）
IPC C08K003/04（2）
发明人 HAN Z（2） SONG Q（2） WANG B（2）
公开年 2021（2）
申请年 2021（2）
专利权人 HIT ROBOT GROUP WUXI SCI TECHNOLOGY（2）

Preparation device used for preparing integrated polyimide thermally conductive grid film/thermally conductive silica gel composite material, comprises side inner walls which are in each direction equipped with adjustable height clamps for clamping polyimide thermally conductive grid film.

SONG Q, WANG B, HAN Z

Composite thermal conductive material with soft surface with grid distribution for forming grid structures, has heat-conducting cover layer which is arranged on heat-conducting substrate on which graphene composite heat-conducting sheet is placed.

SONG Q, WANG B, HAN Z