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B29(3)
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C08K003/04(3)
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2015(3)
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2014(2)
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Polyamide-boron nitride composite material used for lamp cooling, contains magnesia, boron nitride, chopped glass fibers, polyamide, alumina whiskers, vapor phase alumina, graphene microchip, copper oxide flakes and ethanol.
QIN T
Modified acrylonitrile butadiene styrene material comprises acrylonitrile butadiene styrene, flame retardant including modified graphene, flame retardant synergist including magnesium sulfate whisker, and composite anti-aging agent.
ZHOU Q
Ultra-high sheet resistance metallized film capacitor contains metallocene polyethylene, graphene, tetrapod-shaped zinc oxide whisker, silicon carbide whisker, magnesium borate whisker, and low-density polyethylene.
KONG X
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