国家/地区 中国（2）
IPC部 C（2）
IPC大类 C08（2） C09（2）
IPC小类 C08K（2）
IPC C08K003/04（2）
发明人
公开年 2023（2）
申请年 2022（2） 
专利权人

Heat-conducting gel used for heat dissipation of electronic device, comprises silicone oil matrix, bisphenol-A-type epoxy resin and heat-conducting filler comprising modified graphene, modified diamond and modified carbon nanotubes, where surface of modified graphene is modified with amino group.

HE Y, LIU F, YU G

Polyurethane high-thermal conductivity film used as photothermally controllable film, is prepared by reacting three-dimensional carbon composite powder and thermoplastic polyurethane, concentrating obtained three-dimensional carbon/polyurethane assembly, dripping on substrate and heat-treating.

CHEN J, WANG C, LI H, LUO W