国家/地区 中国（2）
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08K（2）
IPC C08K003/04（2）
发明人
公开年 2023（2）
申请年 2022（2） 
专利权人

Electronic device such as chip, comprises electronic component, heat sink in which surface its is provided with magnetic layer containing permanent magnetic material, and composite thermal-conductive material comprising organic matrix and ferromagnetic particles.

FANG H, XU Y, ZHENG K

Preparation of graphene oxide thermally conductive film by dispersing graphene oxide, nanocellulose and polysorbate 20 in deionized water, adding aqueous-based epoxy resin and curing agent to disperse, forming layer of graphene oxide, and coating slurry gel system thermally conductive film.

CHEN D