国家/地区 中国（2）
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08K（2）
IPC C08K003/04（2）
发明人 CHEN Y（2）
公开年 2023（2）
申请年
专利权人

Preparing silicon dioxide filling type epoxy resin copper-clad plate by vacuum-drying nano-silicon dioxide powder, mixing with gamma-aminopropyltriethoxysilane, adding to xylene, drying, dispersing oxidized graphene- silicon dioxide composite material, covering copper foil and curing.

XIE J, WANG X, CHEN Y

Epoxy resin composite material with low viscosity and high mechanical strength for preparing high performance epoxy system with low viscosity and high mechanical strength comprises epoxy resin, curing agent, multidimensional composite dispersion liquid and reinforcing agent.

CHENG J, CHEN Y, ZHANG J