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C(2)
H(2)
IPC大类
C09(2)
H05(2)
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C09D(2)
H05K(2)
IPC
C09D007/12(2)
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2012(2)
专利权人
Manufacture of graphene used for manufacture of graphene junction, involves applying load to aggregated-form graphite particles, such that interlayer bonding of all graphite crystals of aggregated-form graphite particles is destroyed.
KOBAYASHI H
High heat conduction and dissipating coating for electronic product, comprises base resin and padding such as graphite, graphene, pyrolytic carbon, carbon fiber, graphite fiber, zirconium oxide, silicon nitride and boron carbide.
SHEN F
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