国家/地区 韩国（2）
IPC部 C（2）
IPC大类 C08（2） C09（2）
IPC小类 C08K（2）
IPC C09D201/00（2）
发明人
公开年
申请年 2021（2） 
专利权人

Adhesive used in polymer blend composition for bonding several substrates, comprises carrier particles having preset specific surface area and polymer coating agent coated on surface of carrier particles.

MAN C, LEEJONGHWAN, KIM T H, PARK J H

Lighting fixture e.g. lamp, is applied with heat dissipation composition comprising polymer resin, dispersion stabilizer and thermally conductive filler, which is surface-modified with silane coupling agent after coating with agarose.

SHIN J, SHIM S E