国家/地区 中国（2）
IPC部 C（2）
IPC大类 C08（2） C09（2）
IPC小类 C08K（2）
IPC C08K003/04（2）
发明人
公开年 2022（2）
申请年
专利权人

Adhesive film for producing structure e.g. heat-dissipating substrate, is formed of adhesive resin composition that contains thermally conductive filler composed of at least one of graphene having two-dimensional structure and single-walled boron nitride, thermosetting component and binder polymer.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Hybrid adhesive composition useful for electromagnetic wave shielding, comprises conductive metal particles, graphene, adhesive resin and curing agent, where graphene is chemically modified graphene, and adhesive resin is bonded to functional group of chemically modified graphene.

KIM M G, HONG S M, OH J T, KIM J H, KIM J, OH J, HONG X, KIM M, MYEONGGI K