国家/地区 中国（2）
IPC部 C（2）
IPC大类 C09（2）
IPC小类 C09J（2）
IPC C09J009/02（2）
发明人 LU J（2）
公开年 2021（2）
申请年 2021（2） 
专利权人 LU J（2）

Positive temperature coefficient heating body packaging structure; graphene conductive adhesive used in packaging structure comprises e.g. far-infrared emitting agent, copper powder, and high temperature resistant high molecular materials.

LU J

Graphene conductive adhesive for bonding positive temperature coefficient (PTC) heating sheet, comprises far-infrared emitter, graphene, copper powder and high-temperature resistant polymer materials, where high-temperature resistant polymer material contains high-temperature resistant glue.

LU J