国家/地区 中国（3）
IPC部 C（3）
IPC大类 C09（3）
IPC小类 C09K（3） H01Q（2）
IPC C09K003/00（3）
发明人 LI Y（2）
公开年 2022（3）
申请年 2022（2） 
专利权人

Laser contacting process used for bonding semiconductor elements, involves controlling amount of laser light absorbed by laser control structure, and bonding contacting sections and contacting object.

JANG K S, EOM Y S, CHOI G, CHOI K, JOO J, MOON S, LEE C, CHANG K S, MUN C K, JOO J H, MOON S H, LEE C M, WEN S, ZHU Z, CUI G, YAN L, CHANG K

Low-frequency radar absorbent, comprises nickel-zinc ferrite, doped with a small amount of iron-silicon-aluminum and graphene.

ZHANG T, LIU M, CHEN K, TAN C, LI Y

Preparing wave-absorbing material comprises using mixed solution of organic iron salt and triethylene glycol preparation graphene as mixed solution of organic iron salt and triethylene glycol, carrying out boiling reflux treatment to the mixed solution and separating dry liquid.

XU F, LI Y