国家/地区 中国（3）
IPC部 C（3）
IPC大类 C22（3） C23（2）
IPC小类 C22F（3） C22C（2） C23C（2）
IPC C22F001/08（3）
发明人 WANG C（3）
公开年
申请年
专利权人

Preparing fine-grained high-purity oxygen-free copper plate comprises e.g. cleaning hearth of electron beam cooling bed smelting furnace, heating hot-pressed slab, milling milled hot-rolled billet up and down, annealing semi-finished sheet material, and cutting according to product shape.

WANG W, WANG C, LIU X, LIU Q, ZHOU B, WANG J, SUN J, LIANG X, WANG Q

Manufacturing copper alloy for hydrocooling exchangers based on single crystal silicon smelting comprises e.g. preparing furnace material comprising chromium, zirconium, silicon, magnesium, rare earth, and graphene supported cerium powder.

ZHANG Q, ZHANG H, YU G, LI L, MA M, WU B, WANG C, JING L

Preparing an oxidation resistant bonded copper wire material comprises e.g. purifying raw material of the copper wire, heating, adding the melted copper solution, spraying the graphene liquid, drying and applying the antiseptic oil.

CHENG X, ZHANG L, WANG C