国家/地区 美国（2）
IPC部 C（2）
IPC大类 C23（2）
IPC小类 C23C（2） H01L（2）
IPC C23C014/12（2）
发明人
公开年 2022（2）
申请年 2022（2）
专利权人

Digital formation of two-dimensional materials structures used for electronic components, involves generating donor substrates containing back surface and front surface, applying coating to front surface, and irradiating coating containing donor material.

ZERGIOTI I, PAPAZOGLOU S, ZACHARATOS F, LOGOTHETI A, PESQUERA A, ZURUTUZA A, NAVEH D

Material for hole transport layer of light emitting device, has deposited film whose potential gradient of surface potential is in specific range.

WATABE T, SEO H, UEDA L, KAWANO Y, TOMOHIRO K A, KITANO Y, DOS T, OHSAWA N, SEO S, TOSU T, KUBODA T, UEDA A, KONO Y, KUBOTA T, TORISU T, OSAWA N