国家/地区 中国（2）
IPC部 C（2）
IPC大类 C23（2） C25（2）
IPC小类 C23C（2）
IPC C23C028/02（2）
发明人 WANG X（2）
公开年
申请年
专利权人

Method for metallizing surface of graphene film in electronic device, involves plating metal adhesive layer on surface of graphene film base body by magnetic control sputtering method, and plating metal plating layer on surface of metal adhesive layer by electroplating method.

LIAO Q, LI Y, XU L, JI H, WANG X, MA S, ZHANG Y

Preparing copper or graphene-plated magnesium alloy composite material involves insulating aluminum and zinc, smelting aluminum after heat preservation is completed, and adding zinc to aluminum melt and mixing, and melting zinc.

ZHOU L, LI X, WANG X, YI J, ZHANG X, ZHOU X