国家/地区
IPC部 C（2）
IPC大类 C25（2）
IPC小类 C25D（2）
IPC C25D003/38（2）
发明人
公开年 2016（2）
申请年 2015（2）
专利权人

Copper seed and graphene composite multilayer cooling film has graphene layer and copper layer.

LIU L

Formation of complex plating film used in electronic material, involves adding graphene-coated metal powder to plating solution, and forming plating film by performing electric plating in solution to which metal powder is added.

SUH S, SONG Y, PARK J, KIM T, SON H, SHIN J, LEE M, LEE J, LEE C, CHO Y, BAEG S, AHN B, YUN S