国家/地区 世界知识产权组织（3）
IPC部 C（3）
IPC大类 C25（3） C23（2）
IPC小类 C25D（3） C23C（2）
IPC C25D005/56（3）
发明人
公开年 2019（2）
申请年
专利权人

Enhancing surface adhesion of polyetherimide for metal plating involves contacting sulfuric acid with polyetherimide substrate surface to form pre-etched substrate, and contacting substrate with sulfuric acid and periodate ions mixture.

NARUSKEVICIUS L, HYMAN M

Surface-metalized polymer article comprises polymer component, first layer composed of multiple graphene sheets and conducive filler coated on polymer component surface, and second layer of plated metal deposited on first layer.

LIN Y, LEE S, JHONG Y, ZHAMU A, JANG B Z, LI S

Plastic plating comprises coating the surface of plastic substrate with graphene-based conductive ink, curing graphene-based conductive ink to form graphene-based conductive ink layer, electroplating after depositing and drying.

ZHENG N, MAO H, WU B, CAO F