国家/地区 中国（3）
IPC部 C（3）
IPC大类 C25（3）
IPC小类 C25D（3）
IPC C25D013/02（3）
发明人 LI X（3）
公开年 2021（3）
申请年 2021（3）
专利权人 NORTHWEST IN.（2）

Preparing high-orientation and high thermal conductivity graphene/copper composite material used as thermal-conducting reinforcing body for electronic device heat power density, comprises e.g. adding isopropanol into ethanol, ultrasonically processing, and forming highly oriented graphene film.

LI L, ZHANG W, DONG L, HUO W, LI X, CHANG G

Preparing high toughness layered titanium-based composite material comprises e.g. depositing graphene oxide and silicon powder on titanium foil of cathode, stacking surface co-deposition graphene oxide-silicon coating layer and sintering.

HUO W, LEI C, WU H, LI L, CHANG G, LI X, ZHANG Y

Phenylacetylene functionalized graphene/copper composite thermal conductive material, prepared by e.g. preparing phenylacetylene functionalized grapheme and adding into acidic copper sulfate solution under magnetic stirrer.

JIANG J, LI X, HUANG Y, WANG H, LI Q