国家/地区 中国（2）
IPC部 C（2）
IPC大类 C22（2）
IPC小类 C25D（2）
IPC C25D013/02（2）
发明人
公开年 2021（2）
申请年
专利权人

Preparing high-orientation and high thermal conductivity graphene/copper composite material used as thermal-conducting reinforcing body for electronic device heat power density, comprises e.g. adding isopropanol into ethanol, ultrasonically processing, and forming highly oriented graphene film.

LI L, ZHANG W, DONG L, HUO W, LI X, CHANG G

Continuous electrophoretic deposition modified carbon fiber reinforced multi-matrix composite material comprises carbon fiber, inorganic powder including graphene powder, aluminum oxide powder and/or zirconium oxide powder, and substrate.

CHEN Z, LIAO J