国家/地区 中国（4）
IPC部 C（4）
IPC大类 C09（4）
IPC小类 C09D（2） H01L（2）
IPC
发明人 CHEN C（4）
公开年 2017（2）
申请年
专利权人

Composition used for fabricating semiconductor structure on semiconductor device for removing metal-containing layer of pellicle structure, comprises water, oxidizing agent(s), and acid(s).

CHEN C, CHANG C, LEE Y, LIU W D, WINDOW C, LEE W, LU W, LIU W, LI Y, ZHANG Z, CHEN Z

Oxidized graphene adhesive comprises solvents and graphene oxide is prepared by performing hydrophilic treatment, coating, drying and bonding.

GAO C, LI Z, ZHANG C, CHANG D, CHEN C, GAO W, GUO Y, HAN Y

Silane-modified graphene printing ink used for electronic components comprises graphene powder, base resin, surface treatment agent, solvent, and curing agent.

CHEN C, LIN X, LU L

Printed electronic device such as integrated circuit and printed circuit board comprises substrate and layer of electrically conductive ink comprising functionalized graphene sheets and binder applied to the substrate.

AKSAY I A, CHEN C, CHIANG K S, KORKUT S, LETTOW J S, PRUDHOMME R K, CRAIN J M, AKSAY I, CHIANG K, LETTOW J, PRUDHOMME R, PRUD HOMME R K, KORKUT S A, PRUD H R K, AKSAY L A