国家/地区 中国（2）
IPC部 C（4）
IPC大类 C01（4） C08（4）
IPC小类 C01B（4）
IPC C08K003/04（4）
发明人
公开年 2021（3）
申请年 2021（4）
专利权人

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Making lightweight armor involves grinding particles of rare-earth material to particle size, mixing with positively charged aqueous dispersion to create slurry, admixing slurry to silica gel, sublimating, and deposing nanoparticles.

WHARTON M T

Preparing polyglycidyl ether functionalized stable metal/graphene dispersion system comprises e.g. dissolving trimethylolpropane, filling with nitrogen, adding methanol solution of potassium methoxide, dripping glycidol, adding methanol and acetone, and obtaining graphene oxide.

LI D

Preparing graphene oxide-polyaniline-gold nano-particle solution involves preparing graphene oxide powder, preparing graphene oxide-polyaniline nano composite, and preparing gold nano-particle solution.

CHEN G, HUANGFU H, REN R, DANG L