国家/地区 世界知识产权组织（4）
IPC部 C（4）
IPC大类 C08（4） C01（2） C09（2）
IPC小类 C08L（4）
IPC C08L079/08（4）
发明人
公开年 2021（3）
申请年 2021（4）
专利权人

Polymer composition used in semi-conductors, consumer electronics and industrial constructions, comprises polyetherimide resin, crystalline polyester resin, inherently dissipative polymer, and transesterification inhibitor.

JIANG X, ZHENG Y, CHENG Y

Preparing recyclable nano composite material comprises providing reinforcement material including conductive material or conductive material and insulating material and compounding reinforcement material and the base material, where conductive material includes e.g. carbon nanotube and graphene.

QU S, XI J, LV W

Phthalonitrile composite material for heat conduction and insulation fields, involves heat conducting filler distributed in phthalonitrile matrix resin or heat conducting filler layer partially covered on phthalonitrile micro-sphere surface.

ZHOU H, GUO Y, ZHAO T, LIU X, DING J, ZHAO Z

Composite material useful for electronic device, preferably galvanic cell, supercapacitor, or fuel cell, comprises polyamide-imide, and nanoplatelets.

HODGE S A, GALHENA D T L, GALHENA D T L G