国家/地区 中国（7）
IPC部 C（7）
IPC大类 C08（7） C09（7） B05（2）
B32（2） H01（2）
IPC小类 C08J（7）
IPC C09D005/33（7）
发明人 DAI L（2）
公开年 2021（2） 2023（2）
申请年 2017（2）  2020（2）  2022（2） 
专利权人

Thermoplastic composite material with heat accumulation function of heat release, has infrared heat reflection protective coating on thermoplastic elastomer surface, where elastomer has phase change material, random thermoplastic vulcanizate polypropylene, low-density polyethylene and graphene.

LIU H

Photovoltaic backboard used in photovoltaic module, comprises weather-resistant layer, base material layer, black reflecting layer comprising organic pigment, and barrier layer comprising high barrier composition containing polymer resin, nano material and additive.

ZHOU G, LIN W, LI N

Three-dimensional diffuse reflection and wave absorbing compatible type stealth coating useful in compatible stealth of buildings e.g. aircraft and tanks, comprises reflective surface on aircraft or target body surface turns into diffuse reflective surface and deep wave absorbing coating.

CAO W

Electromagnetic shielding composite material useful in field of 5G communication or aerospace, comprises absorption layer and reflective layer compounded on absorption layer; absorption layer includes modified resin layer.

RAN X, WANG C, FU C, NIE W, QIAN J, GAO Y, CHU H

Graphene-containing vanadium dioxide composite powder useful for preparing vanadium dioxide composite coating, comprises core-shell particles and graphene dispersed between the core-shell particles.

DAI L, TANG Z, WANG Y, FENG Q, ZHENG J, YUAN X

Insulating ceramic graphene comprises sound insulation, cooling water-based paint, using high-strength organic/inorganic nano-composite transparent film material and includes e.g. ceramic insulation technology and doped tin dioxide.

CHU Z, TONG Z, ZHAO Y

Graphene dispersant used in e.g. preparation of graphene composite powder, and graphene composite film, comprises polyaniline oligomer or derivative which is electroactive polymer, and combines with graphene via pi-pi bond.

DAI L, GU L, YU H, ZHENG Y, MA J, ZHAO H, LIU S, DING J