国家/地区 中国（2）
IPC部 B（2）
IPC大类 B21（2）
IPC小类 B21B（2）
IPC B21B003/00（2）
发明人
公开年 2022（2）
申请年
专利权人

Preparing copper alloy semiconductor lead frame for circuit board, comprises heating copper alloy ingots, removing oxide, aging, adding copper alloy semi-finished product silver plating bath for silver-plated plating treatment, and activating.

CAO G, LI C, XU J, YIN H

Preparation method of metal magnesium-copper-graphene layered composite material, involves annealing accumulated and rolled plate to obtain laminated magnesium-based composite plate reinforced by graphene and copper.

PAN F, WANG Y, LUO H, TANG B, LI J, CHEN X