国家/地区 中国（2）
IPC部 C（2）
IPC大类 C25（2）
IPC小类 C25D（2）
IPC C25D015/00（2）
发明人 WEI W（2）
公开年 2021（2）
申请年
专利权人

Preparing bright high-conductivity graphene/copper complex material comprises e.g. preparing graphene/copper deposition liquid, adding gelatin and sodium dodecyl sulfate as additive, adding polyacrylamide and thiourea, and depositing.

WEI K, WANG S, WEI W, CHU F, DU Q

Composite plating layer integrated insertion hole assembly for electric connector, has contact spring ring provided with elastic spring claw and plating layer of jack formed with gold-graphene composite plating layer.

ZHOU S, SHEN Y, WEI W, WANG R, LUO H, LIU B, YU G