国家/地区 美国（5） 中国（3） 欧洲专利局（EPO）（3） 韩国（3） 日本（2） 世界知识产权组织（2）
IPC部 B（6）
IPC大类 B05（6）
IPC小类 B05D（6）
IPC C09D163/00（6）
发明人
公开年 2021（2）
申请年 2021（2） 
专利权人

Coating substrate by depositing a conductive layer comprising electrically conductive material over substrate, where conductive layer has specific resistivity, and depositing anti-icing layer comprising nanomaterials over conductive layer to form coating system.

KINLEN P J, PRIFTIS D

Corrosion prevention composition for metal substrate, comprises sacrificial metal particles, where sacrificial metal particles comprise metal selected from nickel, molybdenum, or cobalt, and sacrificial metal particles are not passivated.

HAWKINS T, VIRTANEN J A

Coated substrate used in e.g. vehicles, bus bars and metal wires, contains first coating layer comprising electrodepositable coating layer, and second coating layer comprising powder coating layer on at least portion of first coating layer.

VISSER S J, WOODWORTH B E, GONDERJONES H, SCHNEIDER J R, MOORE K L, FOLLET M L, MA L, MUNRO C H, POLLUM M M, FRENCH M S, CONDIE A G, HARRISON A E, SCHWENDEMAN I G, DEI D K, BANCROFT C N, APANIUS C, SYLVESTER K T, DEDOMENIC C J, PUODZIUKYNAITE E, HOLLY G, AMII H, NOEL B C, CHRISTOPHER A, POLLUM J M M, GONDERJONES H A

Composition used in protective coating of steel structure, comprises performance modifier and modified filler comprising heavy calcium carbonate, fine ceramics, beryllium oxide, boron nitride, chromium oxide, carbon fiber ash and graphene.

PARK D S

Graphene dispersant used in e.g. preparation of graphene composite powder, and graphene composite film, comprises polyaniline oligomer or derivative which is electroactive polymer, and combines with graphene via pi-pi bond.

DAI L, GU L, YU H, ZHENG Y, MA J, ZHAO H, LIU S, DING J

Insulating composition for manufacturing substrate such as printed circuit board comprises graphene oxide and insulating material comprising graphene oxide; and polar solvent having specific solvent polarity index.

JI S Y, SEO S H, HAM S J, KIM S H, SOO Y J, SHANG H S, SUK J H, SEUNG H K