国家/地区 世界知识产权组织（3）
IPC部 C（3）
IPC大类 C09（3） H05（3）
IPC小类 C09D（3）
IPC H05K009/00（3）
发明人
公开年 2022（2）
申请年 2021（3）
专利权人

Electromagnetic interference shield comprises substrate, metal-based conductive additive, and binder incorporated with metal-based conductive additive and deposited as electromagnetic interference shielding coating on substrate.

ELKADY M F, LANE S, KANER R B, KAVANAUGH J

Composition used in electronic component for shielding electromagnetic waves, comprises silver particles, resin and alkoxysilane compound.

TAKASHI Y, YONEDA T

Self-healing electromagnetic shielding material useful in electronic device, comprises first graphene resin layer, a carbon fiber material resin layer and a second graphene resin layer that are stacked in sequence.

SUN R, TIAN D, WEI J, ZHAO Z, ZHANG L, ZHANG H, HU Y