国家/地区
IPC部 C（2）
IPC大类 C09（2）
IPC小类 C09D（2）
IPC C09D163/00（2）
发明人
公开年 2012（2）
申请年 2012（2） 
专利权人

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Anticorrosive paint comprises specified amount of film-forming material, mixture of polyaniline and graphene composite, pigment, padding agent, sagging resistant agent, dispersing agent, defoaming agent and solvent.

FAN Z, WANG Y, WEI T, YAN J